In the era of smartphones as king, how to make them thinner and smaller, at the same time, "brain" is smart enough to have more functions, which is the expectation of many people, but also the bottleneck in the progress of related technology.
Nowadays, this problem has been gradually conquered by Zhang Huaiwu, a professor at the University of Electronic Science and Technology. Over the years, Zhang Huaiwu led a team to work on the "Printed Electronics" project to overcome the bottleneck of electronic information products, including smartphones.
Now, China has become the third country in the world to master the core technology of "high density interconnection hybrid integrated printed circuit" and "printed composite electronic materials and integrated embedded devices" after the United States and Japan. In this process, China's high-end four-generation printed electronics industry has grown from scratch, from weak to strong, and made China's "smart manufacturing" occupy a considerable proportion of the international market share.
Scientific problems need to be solved urgently
Where there is electronic information, there must be printed circuit boards. China is a big producer of printed circuit. However, most of our printed circuit products have no intellectual property rights, low technology content and simple processing products. "The advanced products with high technology content and high added value are monopolized by foreign printed circuit manufacturers." Zhang Huaiwu said.
The high integration, miniaturization, portability and multi-function of modern electronic equipment require PCB to develop towards the fourth generation board with high density, high reliability, high thermal conductivity and anti-electromagnetic interference. Take smartphones as an example, in order to make them smaller, more agile and smarter, it is necessary to refine their internal structure. Zhang Huaiwu said that the printing of electronics is the key to solve this problem, and it is also the most cutting-edge technology in the relevant fields around the world.
The leap from "printed circuit" to "printed electronics" is an international milestone in science. The fourth generation of high density integrated printed circuit is the representative of modern printed electronics. It poses severe challenges to the integration, embedded devices, heat conduction and heat dissipation related materials and technologies.
However, this key technology has long been monopolized by the United States and Japan, and China's related industries are also subject to technological backwardness.
Breaking the Technology Blockade Abroad in Ten Years
Based on the National Key Laboratory of Electronic Thin Films and Integrated Devices, Zhang Huaiwu has been devoting himself to the research of the fourth generation high density integrated printed circuit technology for a long time.
Zhang Huaiwu is responsible for the overall planning and design of the high-density interconnected hybrid integrated printed circuit technology project. On the basis of one experiment, he led his team to develop composite dual-performance materials for the first time in the world. He proposed a theoretical model of thin film magnetic circuit and circuit closure, realized surface printing of inductors, antennas, EMI devices and capacitors and resistors with magnetic cores, and completely solved the technical index of increasing the density of wires and devices per unit area of fourth generation circuit boards.
What is another member of this team? He and his colleagues broke through the technical bottleneck of PCB interconnection at any layer. For the first time in the world, he established the theoretical model of hydrodynamics for fine circuit fabrication, realized the highest horizontal line width/line distance published by IPC Association in the world, and solved the problem of high density wiring of PCB.
This series of innovative achievements marks that China has mastered the core technology of high density interconnected hybrid integrated printed circuit, even surpassing the highest level of Japan and the United States in many indicators.
"We've been working on this technology for ten years." Zhang Huaiwu said that the team started with the basic theory of printed electronics and high thermal conductivity organic materials, gradually went deep into components, circuits, heat dissipation and conduction, electromagnetic interference, packaging systems, step by step, and finally came out of a road of independent innovation.
Promoting the Upgrading of Domestic Industry
Zhang Huaiwu and others have achieved a series of independent intellectual property rights, which laid a solid foundation for the industrialization of printed electronics. But they did not wait for all the conditions to meet the market, but in the process of research and development, they started strategic cooperation with relevant enterprises.
As early as 2002, the team took the initiative to move the industrial front forward to Guangdong, develop school-enterprise cooperation at zero distance, combine technology accumulation with the production of "real knives and real guns" of enterprises, and cooperate with Fangzheng, Yuansheng and other enterprises in Zhuhai successively, thus opening the prelude to the industrialization of "high density interconnected hybrid integrated printed circuit technology" in China.
The cooperation with Founder in Zhuhai is quite representative. From 100 micron line width to 25 micron line width today, the two sides have cooperated to build the first high-density interconnected hybrid integrated printed circuit production platform with the highest technology level and the best equipment in China, which can fully compete with enterprises in the United States and Japan. From January 2011 to December 2013, through the production of a series of printed circuit board products, Zhuhai Fangzheng has accumulated an additional output value of 3.2 billion yuan, resulting in good economic and social benefits.
"Establishing research and development platforms at all levels can achieve sustainable development," he said, recalling the experience of cooperation between industry, University and research. It is not indispensable to close the door to learn, but it is not conducive to the sustainable development of the project.